? semiconductor components industries, llc, 2000 march, 2000 rev. 7 1 publication order number: mc10h350/d
(+5 vdc power supply only) the mc10h350 is a member of motorola's 10h family of high performance ecl logic. it consists of 4 translators with differential inputs and ttl outputs. the 3state outputs can be disabled by applying a high ttl logic level on the common oe input. the mc10h350 is designed to be used primarily in systems incorporating both ecl and ttl logic operating off a common power supply. the separate v cc power pins are not connected internally and thus isolate the noisy ttl v cc runs from the relatively quiet ecl v cc runs on the printed circuit board. the differential inputs allow the h350 to be used as an inverting or noninverting translator, or a differential line receiver. the h350 can also drive cmos with the addition of a pullup resistor. ? propagation delay, 3.5 ns typical ? mecl 10kcompatible logic diagram dip pin assignment ecl v cc a out a in a in b in b in b out gnd ttl v cc c out c in c in d in d in d out oe 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 v cc (+5.0 vdc) = pins 1 and 16 gnd = pin 8 15 14 13 10 12 11 7 6 5 2 4 3 9 pin assignment is for dualinline package. for plcc pin assignment, see the pin conversion tables on page 18 of the on semiconductor mecl data book (dl122/d). http://onsemi.com device package shipping ordering information mc10h350l cdip16 25 units/rail mc10h350p pdip16 25 units/rail mc10h350fn plcc20 46 units/rail marking diagrams 1 16 a = assembly location wl = wafer lot yy = year ww = work week cdip16 l suffix case 620 mc10h350l awlyyww pdip16 p suffix case 648 plcc20 fn suffix case 775 10h350 awlyyww 1 1 16 mc10h350p awlyyww
mc10h350 http://onsemi.com 2 maximum ratings symbol characteristic rating unit v cc power supply (v ee = gnd) 7.0 vdc t a operating temperature range 0 to +75 c t stg storage temperature range plastic ceramic 55 to +150 55 to +165 c c electrical characteristics (v cc = 5.0 v 5%) (see note 1.) t a = 0 c to 75 c symbol characteristic min max unit i cc power supply current ttl ecl 20 12 ma i ih i inh input current high pin 9 others 20 50 m a i il i inl input current low pin 9 others 0.6 50 ma m a v ih input voltage high pin 9 2.0 vdc v il input voltage low pin 9 0.8 vdc v diff differential input voltage (note 1.) pins 36, 1114 (1) 350 mv v cm voltage common mode pins 36, 1114 2.8 v cc vdc v oh output voltage high i oh = 3.0 ma 2.7 vdc v ol output voltage low i ol = 20 ma 0.5 vdc i os short circuit current v out = 0 v 60 150 ma i ozh output disable current high v out = 2.7 v 50 m a i ozl output disable current low v out = 0.5 v 50 m a 1. common mode input voltage to pins 34, 56, 1112, 1314 must be between the values of 2.8 v and 5.0 v. this common mode inp ut voltage range includes the differential input swing. 2. for single ended use, apply 3.75 v (v bb ) to either input depending on output polarity required. signal level range to other input is 3.3 v to 4.2 v. 3. any unused gates should have the inverting inputs tied to v cc and the noninverting inputs tied to ground to prevent output glitching. 4. 1.0 v to 2.0 v w/50 pf into 500 ohms. *positive emitter coupled logic
mc10h350 http://onsemi.com 3 electrical characteristics (v cc = 5.0 v 5%) (see notes 1 & 4) t a = 0 c to 75 c symbol characteristic min max unit ac parameters (c l = 50 pf) (v cc = 5.0 5%) (t a = 0 c to 75 c) t pd propagation delay data (50% to 1.5v) 1.5 5.0 ns t r rise time (note 4.) 0.3 1.6 ns t f fall time (note 4.) 0.3 1.6 ns t pdlz t pdhz output disable time 2.0 2.0 6.0 6.0 ns t pdzl t pdzh output enable time 2.0 2.0 8.0 8.0 ns t pzl 0.3 v oe 1.5 v 1.5 v 1.5 v t pzh t phz 3state output high enable and disable times oe v out 0.3 v v ol 1.5 v 1.5 v 1.5 v t plz v oh 3.5 v +7.0 v open all other t pzl , t plz , o, c, 500 w 500 w d.u.t . 50 pf 3state switching waveforms 3state output low enable and disable times test load *includes jig and probe capacitance v out application note: pin 9 is an oe and the 10h350 is disabled when oe is at v ih or higher.
mc10h350 http://onsemi.com 4 package dimensions plcc20 fn suffix plastic plcc package case 77502 issue c notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
mc10h350 http://onsemi.com 5 package dimensions cdip16 l suffix ceramic dip package case 62010 issue t notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension f may narrow to 0.76 (0.030) where the lead enters the ceramic body. a b t f e g n k c seating plane 16 pl d s a m 0.25 (0.010) t 16 pl j s b m 0.25 (0.010) t m l dim min max min max millimeters inches a 0.750 0.785 19.05 19.93 b 0.240 0.295 6.10 7.49 c 0.200 5.08 d 0.015 0.020 0.39 0.50 e 0.050 bsc 1.27 bsc f 0.055 0.065 1.40 1.65 g 0.100 bsc 2.54 bsc h 0.008 0.015 0.21 0.38 k 0.125 0.170 3.18 4.31 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 16 9 18 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 pdip16 p suffix plastic dip package case 64808 issue r
mc10h350 http://onsemi.com 6 notes
mc10h350 http://onsemi.com 7 notes
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